 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| www..com EMIF03-SIM03F3 3-line IPADTM, EMI filter including ESD protection Features EMI symmetrical (I/O) low-pass filter High efficiency in EMI/ESD protection Lead-free package Very thin package High reliability offered by monolithic integration High reduction of parasitic elements through integration and wafer level packaging Figure 1. Lead-free Flip-Chip package (8 bumps) Complies with the following standards Pin configuration (bump side) 3 RST in 2 RST ext 1 A IEC 61000-4-2 level 4 - 15 kV (air discharge) - 8 kV (contact discharge) IEC 61000-4-2 level 1 - 2 kV (air discharge) - 2 kV (contact discharge) ETSI 102.221 (configuration FIDI = 97) CLK in GND CLK ext B Data in Vcc Data ext C Applications Where EMI filtering in ESD sensitive equipment is required: Figure 2. C2 Configuration Mobile phones and communication systems Computers, printers and MCU Boards A3 RST - in B3 CLK - in C3 Data - in 100 R1 47 R2 100 R3 A2 RST - ext B1 CLK - ext C1 Data - ext Description The EMIF03-SIM03F3 chip is a very low capacitance EMI filter designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. This filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up to 15 kV. B2 GND TM: IPAD is a trademark of STMicroelectronics. May 2010 Doc ID 16798 Rev 1 1/8 www.st.com 8 www..com Electrical characteristics EMIF03-SIM03F3 1 Electrical characteristics Table 1. Symbol Absolute maximum ratings (Tamb = 25 C) Parameter Internal pins (A3, B3, C3): ESD discharge IEC 61000-4-2, level 1, air discharge ESD discharge IEC 61000-4-2, level 1, contact discharge External pins (A2, B1, C1, C2): ESD discharge IEC 61000-4-2, level 4, air discharge ESD discharge IEC 61000-4-2, level 4, contact discharge Line resistance power dissipation at 70 C Operating temperature range Storage temperature range Value Unit VPP 2 2 15 8 60 - 40 to + 85 - 55 to 150 kV Pd Top Tstg mW C C Figure 3. Electrical characteristics - definitions I Symbol VBR = IRM = VRM = Cline = Parameter Breakdown voltage Leakage current @ VRM Stand-off voltage Line capacitance VBR VRM IR IRM IRM IR VRM VBR V Table 2. Symbol VBR IRM R1, R3 R2 Cline Electrical characteristics - values (Tamb = 25 C) Test conditions IR = 1 mA VRM = 3 V per line Tolerance 20% Tolerance 20% Vline = 0 V, Vosc = 30 mV, F = 1 MHz (measured under zero light conditions) 80 37.6 8 Min. 14 50 100 47 10 100 120 56.4 12 Typ. Max. Unit V nA pF 2/8 Doc ID 16798 Rev 1 www..com EMIF03-SIM03F3 Electrical characteristics Figure 4. 0.00 Attenuation measurement A2 - A3 S21 (dB) Figure 5. 0.00 Attenuation measurement B1 - B3 S21 (dB) -10.00 -10.00 -11.6 dB @ 900 MHz -14.9 dB @ 900 MHz -20.00 -20.00 -18.4 dB @ 1.8 GHz -23.1 dB @ 1.8 GHz -30.00 -30.00 -40.00 -40.00 F (Hz) -50.00 100.0k 1.0M 10.0M 100.0M 1.0G F (Hz) -50.00 100.0k 1.0M 10.0M 100.0M 1.0G Figure 6. Attenuation measurement C1 - C3 Figure 7. Analog crosstalk measurement A2 - B3 (30 kHz < F < 6 GHz > 11.8 dB) Crosstalk (dB) 0.00 S21 (dB) 0.00 -10.00 -20.00 -14.8 dB @ 900 MHz -20.00 -40.00 -22.8 dB @ 1.8 GHz -30.00 -60.00 -40.00 -80.00 -50.00 100.0k 1.0M 10.0M 100.0M F (Hz) 1.0G -100.00 100.0k 1.0M 10.0M 100.0M F (Hz) 1.0G Figure 8. Analog crosstalk measurement A2 - C3 (30 kHz < F < 6 GHz > 13.8 dB) 0.00 Crosstalk (dB) -20.00 -40.00 -60.00 -80.00 F (Hz) -100.00 100.0k 1.0M 10.0M 100.0M 1.0G Doc ID 16798 Rev 1 3/8 www..com Electrical characteristics EMIF03-SIM03F3 Figure 9. Digital crosstalk measurements Figure 10. ESD response to IEC 61000-4-2 (+15 kV air discharge) on one line 20 V/Div 1 V/Div trise (10-90%) = 2.5 ns IN IN 20 ns/Div C2 100 ns/Div 10 V/Div 500 mV/Div OUT 175 mV OUT 20 ns/Div C3 100 ns/Div Figure 11. ESD response to IEC 61000-4-2 (-15 kV air discharge) on one line C2 Figure 12. Line capacitance versus applied voltage 21 18 15 C (pF) 10 V/Div IN 100 ns/Div C3 12 9 6 3 10 V/Div OUT 100 ns/Div 0 0 1 2 3 Vr (V) 4 4/8 Doc ID 16798 Rev 1 www..com EMIF03-SIM03F3 Ordering information scheme 2 Ordering information scheme Figure 13. Ordering information scheme EMIF EMI Filter Number of lines Information x = resistance value (ohm) z = capacitance value / 10 (pF) or 3 letters = application 2 digits = version Package F = Flip Chip x = 3: lead-free, pitch = 400 m, bump = 255 m yy - xxx zz Fx Doc ID 16798 Rev 1 5/8 www..com Package information EMIF03-SIM03F3 3 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. Figure 14. Package dimensions 400 m 40 400 m 40 605 m 55 255 m 40 170 m 170 m 1.14 mm 30 m Figure 15. Footprint Copper pad Diameter: 220 m recommended 260 m maximum Solder mask opening: 300 m minimum Figure 16. Marking Dot, ST logo ECOPACK status xx = marking z = manufacturing location yww = datecode (y = year ww = week) 1.14 mm 30 m Solder stencil opening : 220 m recommended xxz y ww Figure 17. Flip-Chip tape and reel specification Dot identifying Pin A1 location 2.0 0.05 0.20 0.02 4.0 0.1 1.24 8.0 0.3 1.24 0.69 0.05 4.0 0.1 All dimensions in mm User direction of unreeling 6/8 Doc ID 16798 Rev 1 3.5 0.1 STE STE STE xxz yww xxz yww xxz yww 1.75 0.1 O 1.55 0.1 www..com EMIF03-SIM03F3 Ordering information 4 Ordering information Table 3. Ordering information Marking JH Package Flip Chip Weight 1.8 mg Base qty 5000 Delivery mode Tape and reel 7" Order code EMIF03-SIM03F3 Note: More information is available in the application notes: AN2348: "STMicroelectronics 400 micro-metre Flip Chip: package description and recommendation for use" AN1751: "EMI filters: recommendations and measurements" 5 Revision history Table 4. Date 03-May-2010 Document revision history Revision 1 Initial release. Changes Doc ID 16798 Rev 1 7/8 www..com EMIF03-SIM03F3 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2010 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 8/8 Doc ID 16798 Rev 1 |
Price & Availability of EMIF03-SIM03F3
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |